高壓側(cè)highside

輸電系統(tǒng)powertransmissionsystem

輸電線transmissionline

固定串聯(lián)電容補(bǔ)償fixedseriescapacitorcompensation

穩(wěn)定stability

電壓穩(wěn)定voltagestability

功角穩(wěn)定anglestability

暫態(tài)穩(wěn)定transientstability

電廠powerplant

能量輸送powertransfer

交流AC

裝機(jī)容量installedcapacity

電網(wǎng)powersystem

落點(diǎn)droppoint

開關(guān)站switchstation

雙回同桿并架double-circuitlinesonthesametower

變電站transformersubstation

補(bǔ)償度degreeofcompensation

高抗highvoltageshuntreactor

無功補(bǔ)償reactivepowercompensation

故障fault

調(diào)節(jié)regulation

裕度magin

三相故障threephasefault

故障切除時(shí)間faultclearingtime

極限切除時(shí)間criticalclearingtime

切機(jī)generatortriping

高頂值highlimitedvalue

強(qiáng)行勵(lì)磁reinforcedexcitation

線路補(bǔ)償器LDC(linedropcompensation)

機(jī)端generatorterminal

靜態(tài)static(state)

動(dòng)態(tài)dynamic(state)

單機(jī)無窮大系統(tǒng)onemachine-infinitybussystem

機(jī)端電壓控制AVR

電抗reactance

電阻resistance

功角powerangle

有功（功率）activepower

無功（功率）reactivepower

功率因數(shù)powerfactor

無功電流reactivecurrent

下降特性droopcharacteristics

斜率slope

額定rating

變比ratio

參考值referencevalue

電壓互感器PT

分接頭tap

下降率drooprate

仿真分析simulationanalysis

傳遞函數(shù)transferfunction

框圖blockdiagram

受端receive-side

裕度margin

同步synchronization

失去同步lossofsynchronization

阻尼damping

搖擺swing

保護(hù)斷路器circuitbreaker

電阻：resistance

電抗：reactance

阻抗：impedance

電導(dǎo)：conductance

電納：susceptance

導(dǎo)納：admittance

電感：inductance

電容:capacitance

印制電路printedcircuit

印制線路printedwiring

印制板printedboard

印制板電路printedcircuitboard

印制線路板printedwiringboard

印制元件printedcomponent

印制接點(diǎn)printedcontact

印制板裝配printedboardassembly

板board

剛性印制板rigidprintedboard

撓性印制電路flexibleprintedcircuit

撓性印制線路flexibleprintedwiring

齊平印制板flushprintedboard

金屬芯印制板metalcoreprintedboard

金屬基印制板metalbaseprintedboard

多重布線印制板mulit-wiringprintedboard

塑電路板moldedcircuitboard

散線印制板discretewiringboard

微線印制板microwireboard

積層印制板buile-upprintedboard

表面層合電路板surfacelaminarcircuit

埋入凸塊連印制板B2itprintedboard

載芯片板chiponboard

埋電阻板buriedresistanceboard

母板motherboard

子板daughterboard

背板backplane

裸板bareboard

鍵盤板夾心板copper-invar-copperboard

動(dòng)態(tài)撓性板dynamicflexboard

靜態(tài)撓性板staticflexboard

可斷拼板break-awayplanel

電纜cable

撓性扁平電纜flexibleflatcable(FFC)

薄膜開關(guān)membraneswitch

混合電路hybridcircuit

厚膜thickfilm

厚膜電路thickfilmcircuit

薄膜thinfilm

薄膜混合電路thinfilmhybridcircuit

互連interconnection

導(dǎo)線conductortraceline

齊平導(dǎo)線flushconductor

傳輸線transmissionline

跨交crossover

板邊插頭edge-boardcontact

增強(qiáng)板stiffener

基底substrate

基板面realestate

導(dǎo)線面conductorside

元件面componentside

焊接面solderside

導(dǎo)電圖形conductivepattern

非導(dǎo)電圖形non-conductivepattern

基材basematerial

層壓板laminate

覆金屬箔基材metal-cladbadematerial

覆銅箔層壓板copper-cladlaminate(CCL)

復(fù)合層壓板compositelaminate

薄層壓板thinlaminate

基體材料basismaterial

預(yù)浸材料prepreg

粘結(jié)片bondingsheet

預(yù)浸粘結(jié)片preimpregnatedbondingsheer

環(huán)氧玻璃基板e(cuò)poxyglasssubstrate

預(yù)制內(nèi)層覆箔板masslaminationpanel

內(nèi)層芯板corematerial

粘結(jié)層bondinglayer

粘結(jié)膜filmadhesive

無支撐膠粘劑膜unsupportedadhesivefilm

覆蓋層coverlayer(coverlay)

增強(qiáng)板材stiffenermaterial

銅箔面copper-cladsurface

去銅箔面foilremovalsurface

層壓板面uncladlaminatesurface

基膜面basefilmsurface

膠粘劑面adhesivefaec

原始光潔面platefinish

粗面mattfinish

剪切板cuttosizepanel

超薄型層壓板ultrathinlaminate

A階樹脂A-stageresin

B階樹脂B-stageresin

C階樹脂C-stageresin

環(huán)氧樹脂epoxyresin

酚醛樹脂phenolicresin

聚酯樹脂polyesterresin

聚酰亞胺樹脂polyimideresin

雙馬來酰亞胺三嗪樹脂bismaleimide-triazineresin

丙烯酸樹脂acrylicresin

三聚氰胺甲醛樹脂melamineformaldehyderesin

多官能環(huán)氧樹脂polyfunctionalepoxyresin

溴化環(huán)氧樹脂brominatedepoxyresin

環(huán)氧酚醛epoxynovolac

氟樹脂fluroresin

硅樹脂siliconeresin

硅烷silane

聚合物polymer

無定形聚合物amorphouspolymer

結(jié)晶現(xiàn)象crystallinepolamer

雙晶現(xiàn)象dimorphism

共聚物copolymer

合成樹脂synthetic

熱固性樹脂thermosettingresin[Page]

熱塑性樹脂thermoplasticresin

感光性樹脂photosensitiveresin

環(huán)氧值epoxyvalue

雙氰胺dicyandiamide

粘結(jié)劑binder

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